Plural semiconductor die housed in common package with split heat sink
US5977630A · kind A · utility
264Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 15, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Aug 15, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3426
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of semiconductor die, which may be of diverse size and diverse junction pattern, are fixed to a common lead frame and within a common package. The semiconductor die are mounted on respective main pad areas that are laterally spaced from one another and which have respective heat sinks. The heat sinks extend from the boundary of the device package and form external pins that are available for external connection at the same or at different potentials. Isolated pins are also provided. The device package may be used for high and low side chopper circuits, synchronous regulator circuits, single-mode bridges, and the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.