Semiconductor device including a semiconductor package with electromagnetic coupling slots
US5977631A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 2, 1998 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Jul 2, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a high-frequency semiconductor chip having first and second surfaces, and including a first high-frequency transmission line on the first surface and a first grounding conductor on the second surface; and a semiconductor package having third and fourth surfaces, and including a second grounding conductor on the third surface and a second high-frequency transmission line on the fourth surface. The high-frequency semiconductor chip is mounted on the semiconductor package so that the second surface opposes the third surface. The semiconductor device further includes first and second slots for electromagnetically coupling the first high-frequency transmission line to the second high-frequency transmission line. The first and second slots on the first and second grounding conductors, respectively, oppose each other and oppose the first and second high-frequency transmission lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.