Dendrite interconnect for planarization and method for producing same
US5977642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1997 |
| Grant date | Nov 2, 1999 |
| Priority date | — |
| Expiry date | Aug 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.