Semiconductor die bonding apparatus having multiple bonding system
US5979739A · kind A · utility
26Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Oct 14, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for bonding semiconductor dies to lead frame strips, each of the lead frame strips having a plurality of adjacently spaced lead frame units. The apparatus includes at least two bond units, each attaching the dies to one of the lead frame strips at a time and one die supply unit supplying the dies alternately to the bond units. The apparatus also includes at least two lead frame strip supply units, each supplying the lead frame strips to respective ones of the bond units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.