Regeneration method and apparatus of wafer and substrate
US5981301A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Feb 21, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/959
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for regenerating a used wafer or substrate by removing a functional coating film formed on the used wafer or substrate, comprising the steps of: PA1 (a) a step for sorting the used wafer or substrate according to the quality, structure or thickness of the functional coating film; PA1 (b) a step for removing the functional coating film, while in a state of holding the used wafer or substrate, (i) by lapping the objective face of the used wafer or substrate with a hard metal-bonded whetstone while applying an electrochemical in-process dressing, (ii) by polishing the objective face while dropping a fine-particle polishing slurry between a polishing plate provided with a pad and the functional coating film, or (iii) by electrolyzing the functional coating film on the objective face placed opposite to an electrode face in an electrolyte solution at a predetermined voltage; PA1 (c) a step for mechanically removing the functional coating film adhered to the end face at an adequate stage; and PA1 (d) a step for washing and drying the used wafer or substrate after removal of the functional coating film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.