Electronic device packages having glass free non conductive layers
US5981880A · kind A · utility
22Cited by
20References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1996 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Aug 20, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09881
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board for use in an electronic device package such as a ball grid array package or organic chip carrier package includes a glass-free dielectric for separating and insulating power cores, circuitry or plated through holes from each other to prevent shorts caused by a migration of conductive material along glass-based prepreg substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.