William E. Wilson
35Patents
12h-index
44Co-inventors
77Inventor score
Filing activity: Dec 23, 1993 → Jul 16, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6204453A | Two signal one power plane circuit board | Electricity | 143 | Expired |
| US6175087A | Composite laminate circuit structure and method of forming the same | Electricity | 140 | Expired |
| US6451509B2 | Composite laminate circuit structure and method of forming the same | Electricity | 109 | Expired |
| US6664485B2 | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 55 | Expired |
| US6388204B1 | Composite laminate circuit structure and methods of interconnecting the same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6204456A | Filling open through holes in a multilayer board | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6479093B2 | Composite laminate circuit structure and methods of interconnecting the same | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5981880A | Electronic device packages having glass free non conductive layers | Electricity | 22 | Expired |
| US6195883A | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 17 | Expired |
| US6521844B1 | Through hole in a photoimageable dielectric structure with wired and uncured dielectric | Emerging Cross-Sectional Technologies | 16 | Expired |
| US5427895A | Semi-subtractive circuitization | Electricity | 15 | Expired |
| US7293355B2 | Apparatus and method for making circuitized substrates in a continuous manner | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6418616B2 | Full additive process with filled plated through holes | Emerging Cross-Sectional Technologies | 12 | Expired |
| US6781064B1 | Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same | Electricity | 12 | Expired |
| US6750405B1 | Two signal one power plane circuit board | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6265075A | Circuitized semiconductor structure and method for producing such | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6264851A | Selective seed and plate using permanent resist | Chemistry; Metallurgy | 9 | Expired |
| US6852152B2 | Colloidal seed formulation for printed circuit board metallization | Electricity | 8 | Expired |
| US6131279A | Integrated manufacturing packaging process | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7353590B2 | Method of forming printed circuit card | Emerging Cross-Sectional Technologies | 8 | Active |
| US6739048B2 | Process of fabricating a circuitized structure | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5922517A | Method of preparing a substrate surface for conformal plating | Physics | 6 | Expired |
| US6027858A | Process for tenting PTH's with PID dry film | Electricity | 6 | Expired |
| US8405229B2 | Electronic package including high density interposer and circuitized substrate assembly utilizing same | Emerging Cross-Sectional Technologies | 5 | Active |
| US6547974B1 | Method of producing fine-line circuit boards using chemical polishing | Electricity | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.