Piezoelectric device and method of manufacturing the same
US5982010A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 1997 |
| Grant date | Nov 9, 1999 |
| Priority date | — |
| Expiry date | Nov 25, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/088
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A piezoelectric device is manufactured by: (1) mirror finishing surfaces of a first substrate and a second substrate made of a piezoelectric element; (2) forming grooves on at least one of the two surfaces of the first and second substrates; (3) joining the mirror-finished surfaces of the first substrate and the second substrate; (4) applying heat to the joined substrates and bonding them; (5) forming an opening on the first substrate so that a part of the exposed areas of the second substrate is exposed through the opening; (6) forming piezoelectric devices by forming electrodes on at least one of the second substrate through the opening and a corresponding area to the exposed area on the rear side of the second substrate; and (7) dividing the bonded substrates into portions each having one of the piezoelectric devices. Through this manufacturing method, piezoelectric devices with high yield ratios and high reliability can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.