Method of providing uniform photoresist coatings for tight control of image dimensions
US5985363A · kind A · utility
31Cited by
15References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Mar 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02118
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for providing a uniform coating of photoresist over substrate for defining high density integrated device and circuit patterns. This is accomplished by applying the photoresist onto the substrate in multiple, separate dispensing steps and leveling spins to attain the designed thickness uniformly over substrate having high topographic surfaces, thereby preserve the integrity of the critical dimension for multi-level alignments used in the fabrication of integrated devices and circuits.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.