Method and apparatus for transforming a substrate coordinate system into a wafer analysis tool coordinate system
US5985680A · kind A · utility
41Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 1997 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Aug 8, 2017 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F9/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for accurately transforming coordinates within a first coordinate system (e.g., a two-dimensional coordinate system associated with a substrate (or portion thereof)) into coordinates in a second coordinate system (e.g., a three-dimensional coordinate system of substrate (or portion thereof) tilted within a wafer analysis tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.