Semiconductor device including a heat radiation plate
US5986336A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Jul 31, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a mounting pad on which the semiconductor element is mounted; first internal leads electrically connected to the semiconductor element; a heat radiation plate spaced from and opposite the semiconductor element with the mounting pad and located between the heat radiation plate and the semiconductor element, the heat radiation plate having a second internal lead; a sealing material encapsulating the semiconductor element, the mounting pad, the first and second internal leads, and part of the heat radiation plate; external leads continuing from the first internal leads and extending outside of the sealing material; and a grounding lead continuous with and extending from the second internal lead of the heat radiation plate, outside of the sealing material, for mechanically mounting and electrically grounding the heat radiation plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.