Test head for semiconductor tester
US5986458A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2889
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A test head structure for a semiconductor test system which makes the replacement of pin cards in the test head easy. The test head is formed of a performance board for mounting a semiconductor device to be tested on; a mother board for functioning as an interface for achieving electric connection between the performance board and pin cards; and a back board for supporting and positioning the pin cards in combination with a housing of the test head. The back board is provided in parallel with an upper surface of the housing of the test head by being fixed inside of the housing, wherein the upper surface of the back board is directly attached to the lower surface of the mother board. Pin cards can be accessed to the test head through the bottom of the test head to be connected to or disconnected from the back board through connectors provided on the lower surface of the back board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.