Semiconductor device packaging and method of fabrication
US5987358A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1998 |
| Grant date | Nov 16, 1999 |
| Priority date | — |
| Expiry date | Feb 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A sub-assembly module for surface mounting on an implantable medical device hybrid module is provided. The sub-assembly module includes one or more electronic components mounted on a substrate. Interconnection between the electronic components and the hybrid module is established by bond pads on the upper and lower surfaces of the substrate and thru-substrate conducting plugs connecting respective upper and lower bond pads. The electronic components are encapsulated in a layer of insulating material. The electronic components may be chip-and-wire mounted to the sub-assembly module and the sub-assembly module may, in turn, be surface mounted to the hybrid module, permitting the integration of chip-and-wire and surface mount processing for a given hybrid module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.