Method for removing thin, organic materials from semiconductor dies and micro-lenses
US5989354A · kind A · utility
10Cited by
6References
80Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Dec 22, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/46
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention is a method for removing organic and other contaminants, such as photo-resist, from semi-conductor dies and micro-lenses by placing the dies in a solution of two parts ethylene, diamine tetra-acetic-acid (EDTA) to one part peroxide at a temperature of between 30.degree. and 55.degree. C., and preferably between 40.degree. and 44.degree. C., for a period of 1-30 minutes, and preferably between 2 and 10 minutes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.