Hermetic CBGA/CCGA structure with thermal paste cooling
US5990418A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16251
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device and method for hermetically sealing an integrated circuit chip between a substrate and a lid while providing effective dissipation of heat generated by the integrated circuit chip. The device includes an integrated circuit chip, carrier substrate, interface coolant, and a lid. The integrated circuit chip is attached to the top of the carrier substrate. The interface coolant is disposed on the top of the integrated circuit chip and the lid is placed on top of the carrier substrate/integrated circuit chip combination and contacts the interface coolant. The interface coolant provides a thermal path for conducting heat from the integrated circuit chip to the lid. The substrate is attached to a circuit board by a ceramic ball grid array (CBGA) or a ceramic column grid array (CCGA).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.