Patent · US Expired

Integrated circuit arrangement having at least two mutually insulated components, and method for its production

US5990536A · kind A · utility

6Cited by

9References

7Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Frank Lau · Bruckmühl, DE
Wolfgang Krautschneider · Ottobrunn, DE
Manfred Engelhardt · Feldkirchen-Westerham, DE

Key dates

Filing date	Jan 6, 1998
Grant date	Nov 23, 1999
Priority date	—
Expiry date	Jan 6, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76232
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit arrangement having at least two components has in a substrate, an insulation structure (4', 5) between the components which covers at least one side of a trench (3) and is thicker at the bottom of the trench than at the neck of the trench. The components are in this case arranged in different planes on the substrate surface and on the trench bottom. The insulation structure effects vertical insulation between the components.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.