Method and compositions for achieving a kinetically controlled solder bond
US5990560A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 22, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Oct 22, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/001
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.