Multi-chip land grid array carrier
US5991161A · kind A · utility
58Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Dec 19, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A land grid array (LGA) carrier includes an interposer having a first surface and a second surface opposite the first surface, with a plurality of locations on the first surface adapted to receive a plurality of semiconductor dice and passive components. The second surface has a plurality of conductive pads coupled thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.