Detecting groups of defects in semiconductor feature space
US5991699A · kind A · utility
264Cited by
11References
42Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1997 |
| Grant date | Nov 23, 1999 |
| Priority date | — |
| Expiry date | Apr 2, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/20
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques for improving manufacturing process control based on inspection of manufactured items at intermediate process steps, based on clustering and binning of defect data. Additionally, the using the defect data produced by inspection machines to improve manufacturing process control specifically relating to semiconductor manufacturing process control. Examples described here relate specifically to semiconductor wafers, but may be generalized to any manufacturing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.