Planarization composition for removing metal films
US5993685A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Apr 2, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/888
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A planarization composition is set forth in accordance with an embodiment of the invention. The composition comprises spherical silica particles having a weight average particle diameter which falls within the range from about 0.03.mu. to about 2.mu. and is mono-disperse in that at least about 90 weight percent of the particles have a variation in particle diameter from the average particle diameter of no more than about .+-.20%. A liquid carrier comprising up to 20 weight percent ROH, and an amine hydroxide which is NR.sub.4 OH or NR.sub.2 NR.sub.3 OH, where each R is HCH.sub.3, CH.sub.2 CH.sub.3, C.sub.3 H.sub.7 or C.sub.4 H.sub.9, in the amount of 0.1 to 10 weight percent; an oxidizer which is in the amount from about 0.5% to 15% weight percent; an acid stabilizer for adjusting the pH to fall within a range from about 7.0 to about 0.5; and the remainder is water. The invention also relates to a thinning, polishing and planarizing apparatus and to a method for carrying out the thinning, polishing and planarizing operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.