Hermetic solder lid closure
US5993931A · kind A · utility
4Cited by
5References
19Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Jun 30, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for leak testing of a hermetic package closure comprises the steps of: creating a pocket in a lid; plating the lid; placing solder in the pocket; melting the solder in the pocket; drilling a hole through the solder and the plated lid creating an unplated area on the plated lid; testing the hermetic package closure for leaks through the hole; heating the solder reflow, wherein surface tension of the solder over the hole and the unplated area enable the solder to form a hermetic closure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.