Robert Grencavich
3Patents
3h-index
18Co-inventors
47Inventor score
Filing activity: Jun 30, 1997 → Oct 9, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7062114B2 | Submount for a photonic integrated circuit (PIC) chip | Electricity | 33 | Expired |
| US7519246B2 | Photonic integrated circuit (PIC) chips | Electricity | 28 | Active |
| US5993931A | Hermetic solder lid closure | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.