Semiconductor processing furnace heating control system
US5994675A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Mar 7, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vertically oriented thermal processor supporting semiconductor wafers within a vertical processing chamber within a process tube about which a furnace heater is supported utilizes a model-base control target in combination with a heating control system configured to heat portions of the furnace in order to achieve a thermally uniform processing chamber environment. A furnace power controller implements a dynamic control system configured to achieve a desired uniform thermal distribution within the processing chamber during various processing cycles for semiconductor wafers. Preferably, the control system monitors thermal conditions within the chamber and compares the conditions with a desired thermal model of the furnace, and activates/deactivates one or more heater elements within the furnace in order to achieve a desired thermal condition within the processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.