Surface mountable integrated circuit package with detachable module and interposer
US5994774A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1997 |
| Grant date | Nov 30, 1999 |
| Priority date | — |
| Expiry date | Oct 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.