Phase-separated dual-cure elastomeric adhesive formulations and methods of using the same
US5997682A · kind A · utility
23Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 26, 1997 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Nov 26, 2017 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/416
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A phase-separated elastomeric adhesive formulation and method of using the same are provided. The phase-separated elastomeric adhesive formulation does not require high temperatures in order to achieve bond strength. The material and methods are particularly advantageous for adhesively bonding both thick and irregularly shaped structures through which relatively low doses of electron-beam energy may not penetrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.