Method for reducing seed deposition in electroless plating
US5997997A · kind A · utility
8Cited by
15References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1997 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Jun 13, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31522
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a novel method of reducing the amount of seed deposited on polymeric dielectric surfaces. The method comprises the following steps: providing a work-piece coated with a polymeric dielectric layer; baking the work-piece to modify the surface of the polymeric dielectric layer; then applying the seed to polymeric dielectric layer and electrolessly plating metal to the seed layer. The invention also relates to a circuit board produced by the method of the present invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.