Thomas R. Miller
47Patents
11h-index
70Co-inventors
74Inventor score
Filing activity: Sep 23, 1992 → Jul 14, 2009
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6608757B1 | Method for making a printed wiring board | Electricity | 111 | Expired |
| US6268016A | Manufacturing computer systems with fine line circuitized substrates | Emerging Cross-Sectional Technologies | 70 | Expired |
| US6388204B1 | Composite laminate circuit structure and methods of interconnecting the same | Emerging Cross-Sectional Technologies | 38 | Expired |
| US6479093B2 | Composite laminate circuit structure and methods of interconnecting the same | Emerging Cross-Sectional Technologies | 30 | Expired |
| US6630743B2 | Copper plated PTH barrels and methods for fabricating | Electricity | 26 | Expired |
| US6291779A | Fine pitch circuitization with filled plated through holes | Emerging Cross-Sectional Technologies | 25 | Expired |
| US5299249A | Heat transfer techniques for moving thermal energy from high power X-ray tubes on rotating CT gantries to a remote location | Mechanical Engineering; Lighting; Heating | 22 | Expired |
| US5953594A | Method of making a circuitized substrate for chip carrier structure | Electricity | 21 | Expired |
| USD342525S | Fuel dispenser | General | 16 | Expired |
| US6221694A | Method of making a circuitized substrate with an aperture | Electricity | 15 | Expired |
| US7582262B2 | Dispenser for flattened articles | Human Necessities | 15 | Expired |
| US6188027A | Protection of a plated through hole from chemical attack | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6570102B2 | Structure for high speed printed wiring boards with multiple differential impedance-controlled layer | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6467160B1 | Fine pitch circuitization with unfilled plated through holes | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7919060B2 | Dispenser for flattened articles | Human Necessities | 9 | Active |
| US6265075A | Circuitized semiconductor structure and method for producing such | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6815126B2 | Printed wiring board with conformally plated circuit traces | Electricity | 9 | Expired |
| US6852152B2 | Colloidal seed formulation for printed circuit board metallization | Electricity | 8 | Expired |
| US6537608B2 | Protection of a plated through hole from chemical attack | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6618940B2 | Fine pitch circuitization with filled plated through holes | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6613162B1 | Multicomponent homogeneous alloys and method for making same | Chemistry; Metallurgy | 8 | Expired |
| US6445769B1 | Internal bearing cooling using forced air | Electricity | 8 | Expired |
| US6593534B2 | Printed wiring board structure with z-axis interconnections | Electricity | 8 | Expired |
| US5997997A | Method for reducing seed deposition in electroless plating | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6905589B2 | Circuitized substrate and method of making same | Electricity | 7 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.