Method for adding layers to a PWB which yields high levels of copper to dielectric adhesion
US5998237A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1996 |
| Grant date | Dec 7, 1999 |
| Priority date | — |
| Expiry date | Sep 17, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0796
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A permanent curable photosensitive liquid dielectric polymer composition is disclosed for making copper printed circuit boards having at least one photosensitive dielectric polymer layer containing vias and circuitry thereon wherein the polymer layer has enhanced copper to dielectric adhesion. The dielectric composition preferably comprises an acrylated epoxy and a metal adhesion effective amount of amorphous silica. Printed circuit boards made using the photodefinable dielectric polymer and a method for making the printed circuit boards are also disclosed. A twice performed permanganate etching process for texturing the dielectric surface is also preferably used to further enhance the copper to dielectric adhesion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.