Process for manufacturing a circuit with filled holes
US6000129A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Mar 12, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249996
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Circuit boards are manufactured by forming a substrate with a dielectric surface, laminating a metal foil to the substrate, and forming holes in the substrate through the foil. A filler material with an organic base may be filled with electroconductive particles or dielectric thermoconductive particles. The filler material is deposited into the holes and is heated to at least partially cure it. The surface of the filler material is seeded and electrolessly plated to form a conductive coating on the metal foil and the filler material. The coating is then patterned to form a wiring layer. A second set of holes may be formed in the circuitized substrate after the hole filling step, which are also electrolessly plated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.