Polishing apparatus
US6001005A · kind A · utility
14Cited by
39References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | May 1, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B7/228
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing machine includes a platform assembly mounted within three support columns. The platform assembly includes fluidically pressurized bladders for urging the upper polish plate toward and away from the lower polish plate. In one embodiment a movable support column is suspended from an overlying frame. The support column is engaged with the upper polish plate so as to selectively raise and lower the platform assembly. In another embodiment, the platform is raised and lowered by threaded shafts so as to engage and thereby displace the upper polish plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.