Multiple chip module configuration to simplify testing process and reuse of known-good chip-size package (CSP)
US6002178A · kind A · utility
Inventor
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention discloses a chip-size package (CSP) ready multiple chip module (MCM) board having a top surface and a bottom surface for mounting and packaging a plurality of integrated circuit (IC) chips on the top surface. The MCM board is provided with a plurality of chip connection terminals on the top surface for electrically connecting to the IC chips. The MCM board further includes a plurality of via connectors in electrical connection with each of the MCM connection terminals. The MCM board further includes a plurality of CSP connection terminals disposed on the bottom surface substantially under the IC chips wherein each of the via connectors penetrating the MCM board for electrically connecting the CSP connection terminals to the MCM connection terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.