Electrostatic adhesion tester for thin film conductors
US6002259A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 20, 1998 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Jan 20, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2203/005
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A electrostatic adhesion tester for thin film conductors. In one embodiment, a device is provided for testing the adhesion strength of a thin film conductor that has been formed upon a substrate. The device includes an adhesion tester that is primarily comprised of a conducting portion. The conducting portion is applied to the thin film conductor so that it does not physically contact the thin film conductor, but leaves a small space there between. A power supply may further be provided for coupling to either the adhesion tester, the thin film conductor, or both in order to create a potential difference between the conducting portion and the thin film conductor. The potential difference creates an electric field between the conducting portion and the thin film conductor that induces stress in the thin film conductor. A measuring device may also be provided for coupling to the adhesion tester and the thin film conductor in order to measure an electrical parameter of the electric field, which is indicative of the adhesion strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.