Multi-layer ceramic substrate having high TC superconductor circuitry
US6002951A · kind A · utility
3Cited by
6References
8Claims
0Family size
Assignee
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Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Dec 14, 1999 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/93
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.