Method and apparatus for washing silicon ingot with water to remove particulate matter
US6006736A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Apr 21, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/045
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for washing a sliced silicon ingot reduces the consumption of detergent used to clean the ingot after it is sliced to define individual semiconductor wafers. The ingot is taken as a unit mounted to a holder after slicing to a pre-washing machine. The machine sprays jets of warm to hot water onto the ingot and holder to flush away dust generated during the slicing procedure which has adhered to the ingot. The water spray removes much of the dust. Thus when the ingot is subsequently washed with detergent, less dust must be removed thereby increasing the effective performance life of a given quantity of detergent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.