Method of bonding a diamond substrate to at least one metal substrate
US6006979A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1997 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Oct 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention: PA1 at least one of the faces of the diamond substrate is covered with a piece of aluminum foil; PA1 said diamond substrate and said piece of aluminum foil are disposed in a chamber under a controlled atmosphere, and they are bonded together by a first thermocompression step under Argon or under a vacuum, thereby forming a composite multilayer substrate; PA1 said composite multilayer substrate is disposed on a metal substrate, the aluminum surface being in contact with the metal substrate; and PA1 said composite multilayer substrate and said metal substrate are bonded together by performing a second thermocompression step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.