Abrasive construction for semiconductor wafer modification
US6007407A · kind A · utility
61Cited by
32References
14Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 20, 1997 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Aug 20, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive construction for modifying a surface of a workpiece, such as a semiconductor wafer. The abrasive construction comprises: a three-dimensional, textured, fixed abrasive element; at least one resilient element generally coextensive with the fixed abrasive element; and at least one rigid element generally coextensive with and interposed between the resilient element and the fixed abrasive element, wherein the rigid element has a Young's Modulus greater than that of the resilient element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.