Wafer dicing/bonding sheet and process for producing semiconductor device
US6007920A · kind A · utility
43Cited by
9References
5Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 17, 1998 |
| Grant date | Dec 28, 1999 |
| Priority date | — |
| Expiry date | Jun 17, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The wafer dicing/bonding sheet of the present invention comprises a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.