Method of and device for planarizing a surface of a semiconductor wafer
US6010828A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 19, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Feb 19, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/168
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a method of and a device for planarizing a photosensitive material, such as a photoresist, located over an irregular surface of a semiconductor wafer. In one embodiment, the method comprises the steps of passing radiation through a first medium and a second medium wherein the first medium is interfaced with the second medium. The method further comprises the steps of passing the radiation from the second medium into the photosensitive material that is interfaced with the second medium to expose the photosensitive material. The first and second mediums and the photosensitive material have radiation absorption coefficients such that the radiation terminates substantially within a plane of the photosensitive material. The method further includes the step of etching the exposed photosensitive material to the plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.