Semiconductor device and method for fabricating same
US6011306A · kind A · utility
4Cited by
6References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 21, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Sep 21, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A pad on a semiconductor chip is connected to a solder ball, which communicates with an external circuit, without using a lead, thereby increasing the degree of freedom of bonding, and miniaturizing the semiconductor device. An insulative shaft provided with conductive parts on its surface is attached to the semiconductor chip generally parallel to the surface of the chip. The pad on the chip is connected to the conductove part of the insulator shaft via a bonding wire, and the solder ball is joined to the conductive part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.