Multilevel interconnect structure for integrated circuits
US6011311A · kind A · utility
39Cited by
4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 1998 |
| Grant date | Jan 4, 2000 |
| Priority date | — |
| Expiry date | Apr 14, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multilevel interconnect structure includes a lower conducting layer, a dielectric layer formed on the lower conducting layer, an upper conducting layer formed partly on the dielectric layer, and an I-shaped via plug for electrically connecting the lower conducting layer and the upper conducting layer. The I-shaped via plug has an upper portion which laterally extends into the upper conducting layer, and a lower portion which undercuts the lower conducting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.