Process and device for forming raised metallised contacts
US6012625A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49149
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Process and device is available for forming a raised contact metallization 18) on a connection surface (11) of a substrate (10) with the use of a wire bonding device with a bonding tool (26). First of all, a wire end section of a contact material wire (13), drawn from a nose-piece (27), is connected to the connection surface (11) with the application of pressure and temperature, and subsequently a separation of the wire end section (29), connected to the connection surface (11), from the remaining contact material wire (13) takes place. The process further includes these steps: PA1 making a first connection between a free end of the wire end section (29) and the connection surface (11) for the formation of a first connection region (21), PA1 making a second connection between a running end of the wire end section (29) and the connection surface (11) or a partial region of the wire end section (29) in such a way that between the first connection region (21) and the second connection region (22) a defined length of wire (19) is formed, and the connection regions (21, 22) form together with the length of wire (19) a contact material volume (25), PA1 remelting of the contact material v…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.