Joachim Eldring
7Patents
6h-index
15Co-inventors
56Inventor score
Filing activity: Apr 10, 1997 → May 14, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6153940A | Core metal soldering knob flip-chip technology | Electricity | 46 | Expired |
| US6757308B1 | Hermetically sealed transmitter optical subassembly | Electricity | 25 | Expired |
| US8025542B2 | Method of performing an operation with rheological compound | Performing Operations; Transporting | 11 | Active |
| US5928458A | Flip chip bonding with non conductive adhesive | Electricity | 11 | Expired |
| US6960032B2 | Method for making hermetically sealed transmitter optical subassembly | Electricity | 9 | Expired |
| US6285562A | Method of contacting a chip | Emerging Cross-Sectional Technologies | 8 | Expired |
| US6012625A | Process and device for forming raised metallised contacts | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.