Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components

US6014218A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Stephan Bradl · Regensburg, DE
• Olaf Heitzsch · Coswig, DE

Key dates

• Filing date: Dec 3, 1998
• Grant date: Jan 11, 2000
• Expiry date: Dec 3, 2018

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B49/12
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A device for end-point monitoring used in the polishing of components, in particular semiconductor components. The device has a textile structure, which may be constructed as a cloth or a pad, and is used to accommodate a component that is to be monitored. The textile-like structure has a windowless construction. The textile structure may be disposed on a platen. Furthermore, a light source, preferably a laser, for emitting a monochromatic red light beam having a preferred wavelength of approximately 800 nm is provided. The red light beam is directed through the textile structure onto the component to be monitored. In addition, a detector is used to detect the red light beam reflected by the component to be monitored. The end-point monitoring may, for example, be carried out by interferometry. In addition, a corresponding method is also described.