Stephan Bradl
20Patents
5h-index
25Co-inventors
69Inventor score
Filing activity: May 5, 1998 → Oct 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7906860B2 | Semiconductor device | Electricity | 32 | Active |
| US7687895B2 | Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips | Electricity | 21 | Active |
| US6337255B1 | Method for forming a trench structure in a silicon substrate | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6014218A | Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components | Performing Operations; Transporting | 10 | Expired |
| US8309454B2 | Structure for electrostatic discharge in embedded wafer level packages | Electricity | 8 | Active |
| US9293423B2 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Electricity | 5 | Active |
| US7911036B2 | Semiconductor wafer with rear side identification and method | Electricity | 3 | Active |
| US10566309B2 | Multi-purpose non-linear semiconductor package assembly line | Electricity | 3 | Active |
| US6459296B2 | Method, system and method of using a component for setting the electrical characteristics of microelectronic circuit configurations | Physics | 3 | Expired |
| US8173534B2 | Method for producing a semiconductor wafer with rear side identification | Electricity | 2 | Active |
| US6447372B1 | Polishing agent for semiconductor substrates | Chemistry; Metallurgy | 1 | Expired |
| US6086269A | Method and apparatus for applying a substance to a surface | Emerging Cross-Sectional Technologies | 1 | Expired |
| US11652084B2 | Flat lead package formation method | Electricity | 0 | Active |
| US8759230B2 | Treatment of a substrate with a liquid medium | Electricity | 0 | Active |
| US11410906B2 | Semiconductor package and method for fabricating a semiconductor package | Electricity | 0 | Active |
| US9601475B2 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Electricity | 0 | Active |
| US11302668B2 | Multi-purpose non-linear semiconductor package assembly line | Electricity | 0 | Active |
| US7759792B2 | Integrated circuit including parylene material layer | Electricity | 0 | Active |
| US7566378B2 | Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium | Electricity | 0 | Expired |
| US7902062B2 | Electrodepositing a metal in integrated circuit applications | Emerging Cross-Sectional Technologies | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.