Thermal grease insertion and retention
US6016006A · kind A · utility
36Cited by
11References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1997 |
| Grant date | Jan 18, 2000 |
| Priority date | — |
| Expiry date | May 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a small space. The cover plate has a pair of ports which allow a thermal grease to be injected into the space between the integrated circuit and the cover plate. The package has a seal that extends around the integrated circuit between the cover plate and the substrate. The seal controls and confines the thermal grease to an area immediately adjacent to the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.