Self-balancing thermal control device for integrated circuits
US6016250A · kind A · utility
17Cited by
6References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 30, 1998 |
| Grant date | Jan 18, 2000 |
| Priority date | — |
| Expiry date | Jan 30, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A self-balancing temperature control device for an integrated circuit (IC) includes a heat sink attached to the IC having thermomorphic fins or vanes. When the IC increases its heat output, the fins or vanes warm up and change their shape in a manner that increases the rate at which heat is removed from the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.