Electroplating process and composition
US6017967A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1996 |
| Grant date | Jan 25, 2000 |
| Priority date | — |
| Expiry date | Apr 1, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/56
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a metal sulfide dispersion used for electroplating nonconductors such as substrates used for the formation of a printed circuit board. A printed circuit board made using the dispersion could have metallized through-holes comprising electrodeposited copper on the walls of the holes with an adsorbed layer of metal sulfide particles between the circuit board base material and the copper on the walls of the through-holes. The metal sulfide is characterized by spherical particles having a mean diameter of less than 100 nanometers and a particle size distribution where less than 10 percent of the particles within the dispersion have a diameter twice that of the mean diameter of all particles within the dispersion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.