Patent · US Expired

Semiconductor chip

US6020050A · kind A · utility

0Cited by

2References

16Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Ulrich Naher · Hersbruck, DE
Adrian Berthold · Birkenfeld, DE
Thomas Scheiter · Munich, DE
Christofer Hierold · Munich, DE

Key dates

Filing date	Oct 10, 1997
Grant date	Feb 1, 2000
Priority date	—
Expiry date	Oct 10, 2017

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24926
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A semiconductor chip has a membrane mounted on supports that are held in the material of the chip so that the membrane is supported at a space from the chip. The membrane may be a metal layer. The supports are columns or webs that extend into the chip material. Electrical connections to the membrane may be made by conductive supports.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.