Method of packaging fragile devices with a gel medium confined by a rim member
US6020219A · kind A · utility
27Cited by
18References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 26, 1997 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Sep 26, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fragile device, such as an integrated circuit chip or a multichip assembly, is packaged by first dispensing a sol surrounding the sides of the device. The sol is laterally confined by means of a rim member typically made of a pre-molded plastic material. The amount of the sol dispensed is not sufficient to run over the top of the rim member. The sol is then heated to form a gel. If desired, a cover member can be put into place onto the top surface of the rim member, for the purpose of additional mechanical protection of the fragile device, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.