Method and apparatus for performing testing of double-sided ball grid array devices
US6020749A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 1996 |
| Grant date | Feb 1, 2000 |
| Priority date | — |
| Expiry date | Nov 12, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2886
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method of constructing and using a test module in situations where internal access to test points on a substrate are unavailable because devices mounted on the substrate block physical access. The test module is itself a solderable substrate and is imposed, for testing purposes, between the main substrate and the mounted devices. For double-sided or stacked main boards, two or more such modules can be used interposed between the mounted devices and the main substrate. Vias in the module serve to make contact with the test points and to carry the signals to the edge of the module where cups can be formed by cutting the edge vias in half.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.